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Test conditions

Soldering temperature:

Soldering duration:

260°C ± 5°C

10 Sec ± 1 Sec

Performance

Capacitance change (∆C/C):

DF Change (∆tgδ):

Insulation resistance :

≤ ± 2%

≤ 30 X at 10 KHZ

≥ limit value.

Test conditions

Temperature:

Relative humidity (RH): 

Test duration: 

+40°C

93% ± 2%

21 Days

Performance

Capacitance charge (∆C/C):

dissipation factor change (∆tgδ):

Insulation resistance:

± 5%          1khz

≤ 50 X at 1 khz

≥50% of limit value.

Test conditions

Temperature:

Test duration:

Voltage applied:

+85°C 

1000 h

1.25 X Vn

Performance

Capacitance change (∆C/C):

DF change: 

Insulation resistance:

Storage: standard environmental conditions.

Performance

Capacitance change(∆C/C):

± 3% for C ≥ 0.1 µF

± 3% for C ≥ 0.1 µF

Impedance vs. frequency (Lead length 2mm).

Typical values.

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